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Advanced Packaging and Integration Engineer with Security Clearance

Company: HRL Laboratories
Location: Malibu
Posted on: May 12, 2024

Job Description:

Essential Duties:
Lead innovation and development of novel 2.5D and 3D semiconductor integration processes for RF and dense high speed mixed signal electronics applications, with attention to all facets of this endeavor (e.gRF electrical performance of both passive and active components, thermal-mechanical constraints, chemical / metallurgical issues, manufacturability/cost constraints, etc.)Address all levels of integration from chip-level integration (e.gdie and wafer stacking, WLFO) to package and PCBPerform theory-driven analyses of candidate approachesOrganize and manage research and development projects to be carried out by technical teams of other domain experts (e.gin each of the technical areas mentioned above)Provide mentorship and guidance to others in all aspects of these projects (technical, organization, reporting, etc.)Develop and maintain relationships with relevant vendors and partner organizationsOrganize and present results, in written reports, journal papers, and oral presentationsCreate and manage work plans to meet or exceed schedule deadlines and technical expectationsLead and contribute to proposal and marketing efforts required to sustain continued R&D effortsRequired Skills:
More than 5 years of experience in developing, characterizing, and exercising semiconductor manufacturing processes and corresponding electronics packagingMore than 5 years of experience with design of experiments and analysis techniques (electrical, mechanical, thermal, chemical, etc.) needed to develop and assess new process tools and techniquesDemonstrated experience developing external partnerships and vendor relationshipsSeveral years of experience in organizing and leading technical research and development efforts, and in preparing presentations and proposals needed to attract research fundingFamiliarity with commercial packaging technology (e.gceramic and laminate chip-level packages, printed circuit boards, interposers, etc.) and integrated circuit processing and integration techniques.
Deep understanding of material science, surface chemistry, semiconductor physics, and thermal/mechanical theory related to electronics processing and assembly techniquesFamiliarity with high-speed electrical characterization methodsUse of Microsoft Office tools (Word, Excel, Powerpoint) and proficiency in writing for reportingRequired Education:
B.Sdegree in Electrical Engineering, Physics, or related scientific disciplineM.SpreferredPhysical Requirements:
Proficiency in use of computers, engineering work stations, complex electronic equipment, oral and written communication, interaction with vendors/colleagues and willingness to work in a fast-paced, deadline-driven environmentAbility to work well in a team and independentlyMust be sufficiently mobile to work within confined spaces and have both visual and hearing acuitySpecial Requirements:
Current U.Sperson status Compensation:
The base salary range for this full-time position is $120,715 - $150,895 + bonus + benefits.
Our salary ranges are determined by role, level, and locationThe range displayed on each job posting reflects the minimum and maximum target for new hire salaries for the positionWithin the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or trainingYour recruiter can share more about the specific salary range during the hiring processPlease note that the compensation details listed reflect the base salary only, and do not include potential bonus or benefits.

Keywords: HRL Laboratories, Malibu , Advanced Packaging and Integration Engineer with Security Clearance, Engineering , Malibu, California

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